Display device and manufacturing method thereof

ABSTRACT

A display device includes: a first substrate including: a display area including a plurality of pixels, and a peripheral area positioned around the display area; a thin film transistor positioned on the first substrate; a pixel electrode layer positioned on the thin film transistor and including more than one pixel electrodes positioned in the display area; and a pixel definition layer positioned on the pixel electrode layer and including a peripheral portion overlapping a voltage transmission electrode. The peripheral portion includes a spacer and an inclination portion connected to the spacer and positioned at a first side of the spacer, and the inclination portion has a concave inclination surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of co-pending U.S. application Ser.No. 14/861,904 filed Sep. 22, 2015, which claims priority to KoreanPatent Application No. 10-2015-0033310 filed on Mar. 10, 2015, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the entirecontents of which are incorporated herein by reference.

BACKGROUND Field

The disclosure relates to a display device and a manufacturing methodthereof.

Description of the Related Technology

A display device, such as for example a liquid crystal display (LCD), anorganic light emitting diode (OLED) display, and an electrophoreticdisplay, includes a field generating electrode and an electro-opticalactive layer. For example, the LCD device includes a liquid crystallayer as the electro-optical active layer. The field generatingelectrode is connected to a switching element such as a thin filmtransistor to receive a data signal, and the electro-optical activelayer converts the data signal into an optical signal to display animage.

Among the display devices, since the organic light emitting diode (OLED)display as a self-light emitting type does not require a separate lightsource, it is advantageous in terms of power consumption, and a responsespeed, a viewing angle, and a contrast ratio thereof are excellent.

The organic light emitting diode (OLED) display includes a plurality ofpixels such as red pixels, blue pixels, green pixels, and white pixels,and may express full colors by combining the pixels. Each pixel includesan organic light emitting element, and a plurality of thin filmtransistors for driving the organic light emitting element.

The light emitting element of the organic light emitting diode (OLED)display includes a pixel electrode, an opposing electrode, and a lightemitting layer positioned between the two electrodes. One of the pixelelectrode and the opposing electrode is referred to as an anode, and theother electrode a cathode. An electron injected from the cathode and ahole injected from the anode are coupled with each other in the lightemitting layer to form an exciton, and the exciton emits light whiledischarging energy. The opposing electrode is formed throughout aplurality of pixels to transfer a predetermined common voltage.

In display devices, when impurities such as moisture or oxygen flow intothe display device from an ambient environment, oxidization, releasing,and the like of the electrode occur, and as a result, a lifespan of thedevice is shortened or light emission efficiency may deteriorate, andproblems such as deformation of a light emitting color may occur.

Accordingly, when the display device is manufactured, sealing isperformed so that an internal element is separated from the outside toprevent impurities such as moisture from penetrating. As such a sealingmethod, in the case of the organic light emitting diode (OLED) display,may be generally, a method of laminating a layer including an organicpolymer such as polyethylene terephtalate (PET) on a completed lowersubstrate, a method of forming a cover or a cap on an encapsulationsubstrate and sealing an edge of a cover lower substrate and theencapsulation substrate with a sealant, or the like.

The above information disclosed in this Background section is only forenhancement of understanding of the background and therefore it maycontain information that does not form the prior art that is alreadyknown in this country to a person of ordinary skill in the art.

SUMMARY OF THE INVENTIVE ASPECTS

A display device according to an embodiment includes: a first substrateincluding: a display area including a plurality of pixels, and aperipheral area positioned around the display area; a thin filmtransistor positioned on the first substrate; a pixel electrode layerpositioned on the thin film transistor and including: a plurality ofpixel electrodes positioned in the display area, and a voltagetransmission electrode positioned in the peripheral area; and a pixeldefinition layer positioned on the pixel electrode layer and including aperipheral portion overlapping the voltage transmission electrode,wherein the peripheral portion includes: a spacer, and an inclinationportion connected to the spacer and positioned at a first side of thespacer, and wherein the inclination portion has a concave inclinationsurface.

The peripheral portion may further include a main portion connected tothe spacer and positioned at a second side opposite to the first side ofthe spacer.

A second substrate facing the first substrate and a sealant formedbetween the first substrate and the second substrate and positioned inthe peripheral area may be further included, and the main portion may bepositioned at a side facing the sealant.

A height of a top surface of the spacer with respect to the firstsubstrate may be higher than a height of a top surface of the mainportion and the inclination portion.

A thickness of the inclination portion may be smaller than a thicknessof the main portion.

A height of the bottom surface of the main portion may be lower than aheight of the bottom surface of the inclination portion.

A voltage transmission line positioned in the peripheral area andtransmitting a common voltage, and a passivation layer positionedbetween the thin film transistor and the pixel electrode layer may befurther included, wherein the passivation layer may include an edge sidesurface exposing the voltage transmission line, and the voltagetransmission electrode may include a first portion covering the edgeside surface of the passivation layer and a second portion connected tothe voltage transmission line.

The spacer may include at least one part covering the edge side surfaceof the passivation layer.

The peripheral portion may cover an edge of the voltage transmissionelectrode.

An edge of the spacer at the first side may have a shape of protrusionsand depressions and include recess portions and convex portions that arealternately arranged.

The inclination portion may include a plurality of portions positionedin the recess portion in a plan view, and each of the plurality ofportions included in the inclination portion may have a concaveinclination surface.

The voltage transmission electrode may include a plurality of holes, andeach of the plurality of portions of the inclination portion mayrespectively overlap each of the holes.

A hole adjacent to a first hole overlapping the inclination portionamong the plurality of holes may be disposed to be aligned with thefirst hole.

A hole adjacent to a first hole overlapping the inclination portionamong the plurality of holes may be disposed to be shifted from thefirst hole.

An edge of the spacer at the first side having the protrusions anddepressions shape may include a first convex portion and a second convexportion having different lengths from each other.

The spacer and the inclination portion may be elongated along an edgeside of the first substrate.

A manufacturing method of a display device according to an embodimentincludes: forming a thin film transistor on a first substrate includinga display area and a peripheral area around the display area; forming,on the thin film transistor, a pixel electrode layer including aplurality of pixel electrodes positioned in the display area, and avoltage transmission electrode positioned in the peripheral area on thethin film transistor; coating a photosensitive material on the pixelelectrode layer to form a coating layer; exposing the coating layer byusing a photomask including a light transmissive part, a light blockingpart, and a semi-transmissive part; developing the exposed coatinglayer; and hardening the developed coating layer to form a pixeldefinition layer including a peripheral portion overlapping the voltagetransmission electrode, wherein the peripheral portion includes a spacerand an inclination portion connected to the spacer and positioned at afirst side of the spacer, and wherein the inclination portion has aconcave inclination surface.

The peripheral portion may further include a main portion connected tothe spacer and positioned at a second side opposite to the first side ofthe spacer.

A thickness of the coating layer corresponding to the main portion maybe thicker than a thickness of the coating layer corresponding to theinclination portion.

According to an embodiment, when applying an impact to the displaydevice including the sealant, the impact wave is effectively dispersedsuch that the impact wave may be prevented from being transmitted to thesealant, thereby increasing the strength of the display device.

Adhesion reliability of the encapsulation region may be increasedwithout a failure of the electrode of the display device including thesealant.

A display device having the narrow bezel while having high strength maybe provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a layout view of a display device according to an embodiment,

FIG. 2 is a cross-sectional view of one pixel of the display deviceaccording to the embodiment,

FIG. 3 is a layout view of a peripheral area of a display deviceaccording to an embodiment,

FIG. 4 is an enlarged layout view of a region A, a region B, or a regionC as a part of a peripheral area of the display device shown in FIG. 3,

FIG. 5 is a cross-sectional view of the display device of FIG. 4 takenalong a line V-V,

FIG. 6 is a cross-sectional view of the display device of FIG. 4 takenalong a line VI-VI,

FIG. 7 is a photo showing a plane shape of a peripheral area of adisplay device according to an embodiment,

FIG. 8 is a view showing a phenomenon that an impact wave is preventedin a peripheral area an impact is applied to a display device accordingto an embodiment,

FIG. 9 is a layout view of a peripheral area of a display deviceaccording to an embodiment,

FIG. 10 is an enlarged layout view of a region A, a region B, or aregion C as a part of a peripheral area of the display device shown inFIG. 9,

FIG. 11 is a cross-sectional view of a display device of FIG. 10 takenalong a line XI-XI,

FIG. 12, FIG. 13, and FIG. 14 are enlarged layout views of a region A, aregion B, or a region C as a part of a peripheral area of the displaydevice shown in FIG. 3 according to another exemplary embodiment,respectively,

FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19, and FIG. 20 are top planviews showing a plane shape of a peripheral portion of a pixeldefinition layer positioned in a peripheral area of a display deviceaccording to an embodiment,

FIG. 21 is a photo showing an arrangement of a part of a peripheral areaof a display device according to an embodiment,

FIG. 22 is a cross-sectional view of a coating layer and a photomask fora pixel definition layer in one process of a manufacturing method of adisplay device according to an embodiment,

FIG. 23 is a cross-sectional view of a pixel definition layer in theprocess shown in FIG. 22 among a process of a manufacturing method of adisplay device according to an embodiment, and

FIG. 24 is a cross-sectional view of a pixel definition layer in theprocess shown in FIG. 23 among a process of a manufacturing method of adisplay device according to an embodiment.

DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS

The present disclosure will be described more fully hereinafter withreference to the accompanying drawings, in which certain embodiments ofthe invention are shown. As those skilled in the art would realize, thedescribed embodiments may be modified in various ways, without departingfrom the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc.,may be exaggerated for clarity. Like reference numerals generallydesignate like elements throughout the specification. It will beunderstood that when an element such as a layer, film, region, orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may also bepresent. In contrast, when an element is referred to as being “directlyon” another element, there are no intervening elements present.

Throughout this specification and the claims that follow, when it isdescribed that an element is “coupled” to another element, the elementmay be “directly coupled” to the other element or “electrically coupled”to the other element through a third element. In addition, unlessexplicitly described to the contrary, the word “comprise” and variationssuch as “comprises” or “comprising” will be understood to imply theinclusion of stated elements but not the exclusion of any otherelements.

A display device according to an embodiment will be described withreference to FIG. 1 to FIG. 8.

FIG. 1 is a layout view of a display device according to an embodiment,FIG. 2 is a cross-sectional view of one pixel of the display deviceaccording to the embodiment, FIG. 3 is a layout view of a peripheralarea of a display device according to an embodiment, FIG. 4 is anenlarged layout view of a region A, a region B, or a region C as a partof a peripheral area of the display device shown in FIG. 3, FIG. 5 is across-sectional view of the display device of FIG. 4 taken along a lineV-V, and FIG. 6 is a cross-sectional view of the display device of FIG.4 taken along a line VI-VI.

First, referring to FIG. 1 and FIG. 3, a display panel 1 of a displaydevice according to an embodiment includes a display area DA which is anarea displaying an image, and a peripheral area PA therearound whenviewed in a plan view. Referring to FIG. 2, when viewed from across-sectional view, the display device 1 includes a lower substrate110 and an encapsulation substrate 210 facing each other.

The lower substrate 110 includes the display area DA and the peripheralarea PA1 therearound, and the encapsulation substrate 210 includes thedisplay area DA and the peripheral area PA2 therearound. When viewed ina plan view, the peripheral area PA2 of the encapsulation substrate 210may be included in the peripheral area PA1 of the lower substrate 110.The peripheral area PA of the display device 1 includes the peripheralarea PA1 of the lower substrate 110 and the peripheral area PA2 of theencapsulation substrate 210.

Referring to FIG. 3, edges of the encapsulation substrate 210 mayinclude an upper side edge E1, a lower side edge E2 facing the upperside edge E1, and a right side edge E3 and a left side edge E4connecting between the upper side edge E1 and the lower side edge E2. Asshown in the drawings, the upper side edge E1, the lower side edge E2,the right side edge E3, or the left side edge E4 may each substantiallybe a straight line, and at least one thereof may include a curved lineportion.

The display area DA includes a plurality of signal lines and a pluralityof pixels PX connected to the signal lines. The plurality of pixels PXmay be arranged substantially in a matrix form, however they are notlimited thereto.

The signal lines are provided on the lower substrate 110, and include aplurality of gate lines or scanning signal lines G1-Gn transferringscanning signals, and a plurality of data lines D1-Dm transferring datavoltages. The gate lines G1-Gn extend substantially in a row directionand are almost parallel to each other, and the data lines D1-Dm extendsubstantially in a column direction and are almost parallel to eachother.

Referring to FIG. 1 and FIG. 2, the pixel PX positioned in the displayarea DA may include at least one switching element Qd connected to atleast one of gate lines G1-Gn, and at least one of data lines D1-Dm anddata line 171, at least one pixel electrode 191 connected to theswitching element Qd, and an opposing electrode 270. In the case of anorganic light emitting diode (OLED) display, a light emitting layer ispositioned between the pixel electrode 191 and the opposing electrode270 to form a light emitting element. The switching element Qd mayinclude at least one thin film transistor. The opposing electrode 270may transmit a common voltage ELVSS.

In order to implement a color display, each pixel PX may display one ofprimary colors, and a desired color may be recognized 7by combining theprimary colors. An example of primary colors may include three primarycolors or four primary colors such as red, green, blue, and the like.Each pixel PX may further include a color filter positioned at a placecorresponding to each pixel electrode and expressing one of the primarycolors, and the light emitting layer may be a colored light emittinglayer.

Referring to FIG. 1, the encapsulation substrate 210 may expose a partof the peripheral area PA1 of the lower substrate 110, and the exposedpart is referred to as a pad part. In the pad part, at least one datadriver 500 to drive the light-emitting device may be mounted in a typeof at least one IC chip. Alternatively, the driver 500 may be mounted ona flexible printed circuit (FPC) film or a printing circuit board to beattached to the pad part in a type of a TCP (tape carrier package), ormay be directly integrated with the lower substrate 110. In the padpart, ends extended from the signal lines such as the data lines D1-Dmof the display area DA may be positioned. The data driver 500 may beconnected to the end of the data lines D1-Dm and transmitting a datasignal to the data lines D1-Dm.

A gate driver 400 to drive the light-emitting device may also bepositioned in the peripheral area PA1 of the lower substrate 110 coveredby the encapsulation substrate 210. The driver 400 may be mounted on thelower substrate 110 in the type of at least one IC chip, or may bemounted on the flexible printed circuit (FPC) film or the printingcircuit board to be attached to the lower substrate 110 in the type ofthe TCP, or may be integrated with the lower substrate 110. The gatedriver 400 may be connected to the gate lines G1-Gn and transmitting thegate signal to the gate lines G1-Gn.

Now, a detailed structure of the display device according to anembodiment will be described with reference to FIG. 1 to FIG. 6.

A buffer layer 111 may be positioned on the peripheral area PA1 and thedisplay area DA of the lower substrate 110 including transparent glassor plastic. The buffer layer 111 may prevent impurities frompenetrating, and a surface thereof may be flat. The buffer layer 111 mayinclude a silicon nitride (SiNx), a silicon oxide (SiOx), a siliconoxynitride (SiOxNy), or the like. The buffer layer 111 may be omitted insome embodiments.

At least one semiconductor layer is positioned on the buffer layer 111.

The semiconductor layer includes a first semiconductor 154 b positionedin the display area DA. The first semiconductor 154 b may include achannel region 152 b, and a source region 153 b and a drain region 155 bpositioned at respective sides of the channel region 152 b and formed tobe doped. The semiconductor layer may further include at least onesecond semiconductor 150 d (see FIG. 5) positioned in the peripheralarea PA1 of the lower substrate 110. Although not shown, the secondsemiconductor 150 d may include a channel region, and a source regionand a drain region positioned at respective sides of the channel regionand formed to be doped.

The semiconductor layer may include amorphous silicon, polysilicon, oran oxide semiconductor.

A gate insulating layer 140 including a silicon nitride (SiNx) or asilicon oxide (SiOx) is positioned on the semiconductor layer.

A plurality of gate conductors are positioned on the gate insulatinglayer 140. The gate conductor includes a first control electrode 124 bpositioned in the display area DA. The first control electrode 124 b mayoverlap a part of the first semiconductor 154 b, particularly thechannel region. The gate conductor may further include at least onesecond control electrode 120 d (see FIG. 5) positioned in the peripheralareas PA1 and PA2. The second control electrode 120 d may include a partoverlapping the second semiconductor 150 d, particularly the channelregion of the second semiconductor 150 d.

The gate conductor may further include a thermal transmission layer 23(see FIG. 5) positioned in the peripheral area PA1 and PA2.

A first passivation layer 180 a is positioned on the gate insulatinglayer 140 and the gate conductor. The first passivation layer 180 a andthe gate insulating layer 140 may include a contact hole 183 b exposingthe source region 153 b of the first semiconductor 154 b, and a contacthole 185 b exposing the drain region 155 b in the display area DA. Thefirst passivation layer 180 a and the gate insulating layer 140 mayinclude contact holes (not shown) respectively exposing the sourceregion and the drain region of the second semiconductor 154 d in theperipheral areas PA1 and PA2.

A plurality of data conductors are positioned on the first passivationlayer 180 a.

The data conductors may include a plurality of data lines 171, a drivingvoltage line (not shown), and a plurality of first output electrodes 175b. The driving voltage line transmits a driving voltage ELVDD and mayinclude a plurality of first input electrodes 173 b extending toward afirst control electrode 124 b. The first output electrode 175 b facesthe first input electrode 173 b on the first semiconductor 154 b. Thefirst input electrode 173 b and the first output electrode 175 b may berespectively connected to the source region 153 b and the drain region155 b of the first semiconductor 154 b through the contact holes 183 band 185 b.

The data conductor may further include a voltage transmission line 177(see FIG. 5) positioned in the peripheral area PA1 and PA2. The voltagetransmission line 177 transmits a common voltage ELVSS.

Referring to FIG. 3, the voltage transmission line 177 may include amain transmission part 177 a and an end 177 b connected thereto. Themain transmission part 177 a is formed along the edge of the displayarea DA and extends along the upper side edge E1, the right side edgeE3, and the left side edge E4 of the encapsulation substrate 210. Theend 177 b is positioned to be close to the lower side edge E2 and mayextend to the pad part of the lower substrate 110. The end 177 b mayinclude two parts positioned at respective ends of the main transmissionpart 177 a and separated from each other near the lower side edge E2,but is not limited thereto.

The data conductor may further include at least one second input/outputelectrode 170 d (see FIG. 5) positioned in the peripheral area PA1 andPA2. The data conductor may further include a test signal line 17 te(see FIG. 5) positioned in the peripheral areas PA1 and PA2. The testsignal line 17 te may be omitted in some embodiments.

The first control electrode 124 b, the first input electrode 173 b, andthe first output electrode 175 b form a switching element Qd as atransistor along the first semiconductor 154 b. The structure of theswitching element Qd is not limited thereto and may be changed invarious embodiments.

The second control electrode 120 d, the second input/output electrode170 d, and the second semiconductor 150 d may together form at least onetransistor 411. The transistor 411 may be included in the driver todrive the light-emitting device. This driver may be the gate driveroutputting the gate signal to the gate line G1-Gn.

A second passivation layer 180 b including an inorganic insulatingmaterial and/or an organic insulating material is positioned on the dataconductor. The second passivation layer 180 b may have a substantiallyflat surface to increase emission efficiency of the organic lightemitting element to be formed thereon. The second passivation layer 180b may have a contact hole 185 c exposing the first output electrode 175b in the display area DA.

In the peripheral area PA1, the second passivation layer 180 b exposesat least a portion of the voltage transmission line 177. Referring toFIG. 5 and FIG. 6, the second passivation layer 180 b includes an edgeside surface 186 positioned in the peripheral area PA1, and the edgeside surface 186 may include a bottom side positioned in the top surfaceof the voltage transmission line 177. Accordingly, the secondpassivation layer 180 b may expose the voltage transmission line 177 inthe peripheral area PA1.

A pixel electrode layer is positioned on the second passivation layer180 b.

The pixel electrode layer includes a pixel electrode 191 positioned ineach pixel PX of the display area DA. The pixel electrode 191 isphysically and electrically connected to the first output electrode 175b through the contact hole 185 c of the second passivation layer 180 b.

The pixel electrode layer may further include a voltage transmissionelectrode 197 positioned in the peripheral area PA1 and PA2. Referringto FIG. 5 and FIG. 6, the voltage transmission electrode 197 includes apart covering the edge side surface 186 of the second passivation layer180 b in the peripheral areas PA1 and PA2 and is physically andelectrically connected to the voltage transmission line 177, therebyreceiving the common voltage ELVSS. The voltage transmission electrode197 may form a step on the portion covering the edge side surface 186 ofthe second passivation layer 180 b.

Referring to FIG. 3, the voltage transmission electrode 197 may beformed along the display area DA, for example, may be formed of a closedline enclosing the display area DA, but it is not limited thereto. Thevoltage transmission electrode 197 may extend with a uniform width asshown, however it may have different widths depending on the position.When the voltage transmission electrode 197 has a non-uniform width,portions having different widths may be alternately disposed.

The voltage transmission electrode 197 may include a plurality of holes97. The plurality of holes 97 are formed on the second passivation layer180 b. The holes 97 may be arranged in a predetermined type such as amatrix shape as an example, or not. The holes 97 provide an outletexhausting a gas generated in the second passivation layer 180 b whenheat is applied in a subsequent process, thereby preventing the voltagetransmission electrode 197 from being lifted from the second passivationlayer 180 b by the gas.

The pixel electrode layer may include a semi-transmissive conductivematerial or a reflective conductive material.

Referring to FIG. 2, the layers on the lower substrate 110, for example,the layers from the buffer layer 111 to the second passivation layer 180b, are referred to together as a transistor layer TFL.

A pixel definition layer 360 is positioned on the second passivationlayer 18 b and the pixel electrode layer.

Referring to FIG. 2, FIG. 5, and FIG. 6, the pixel definition layer 360includes a spacer 360F having a higher top surface than the top surfaceof the main portion 360H with respect to a main portion 360H and thelower substrate 110. The spacer 360F is formed to be higher than themain portion 360H such that the top surface may contact the surface ofthe encapsulation substrate 210. The spacer 360F may uniformly maintaina separation distance between the encapsulation substrate 210 and thelower substrate 110.

The main portion 360H of the pixel definition layer 360 positioned inthe display area DA has a plurality of holes 365 defining a region ofeach pixel PX exposing each pixel electrode 191. The spacer 360F of thepixel definition layer 360 positioned in the display area DA isconnected to the main portion 360H. In the display area DA, the spacer360F may be positioned between adjacent pixels PX.

The main portion 360H of the pixel definition layer 360 positioned inthe peripheral areas PA1 and PA2 includes a plurality of portions eachof which covers the respective hole 97 of the voltage transmissionelectrode 197. The portions of the main portion 360H covering the holes97 are substantially positioned on an upper surface of the secondpassivation layer 180 b. The portions of the main portion 360H eachcovering the respective hole 97 may be separated from each other so thateach of the portions of the main portion 360H covering the holes 97 mayhave an island type. FIG. 5 depicts a sectional view where suchisland-type main portions 360H are located, while FIG. 6 depicts asectional view where such island-type main portions 360H are notlocated.

The pixel definition layer 360 positioned in the peripheral area PA1 andPA2 includes a peripheral portion 360E. The peripheral portion 360E maycover the edge of the voltage transmission electrode 197, and includesthe portion overlapping the voltage transmission electrode 197. Theperipheral portion 360E is positioned on the edge side surface 186 ofthe second passivation layer 180 b thereby including the portionoverlapping the edge side surface 186. The peripheral portion 360E mayinclude a portion that directly contacts the top surface of the portionof the voltage transmission line 177. The peripheral portion 360E ispositioned between a sealant 310 described below and the display area DAto be positioned to be close to the sealant 310.

In detail, referring to FIG. 4, FIG. 5, and FIG. 6, the peripheralportion 360E includes the main portion 360H, the spacer 360F, and aninclination portion 360N connected to each other. The spacer 360F ispositioned between the main portion 360H and the inclination portion360N.

The main portion 360H of the peripheral portion 360E is positioned onthe voltage transmission electrode 197, and covers the edge of thevoltage transmission electrode 197 to not be exposed outside. The mainportion 360H of the peripheral portion 360E may be elongated along theedge of the voltage transmission electrode 197. Also, in the peripheralportion 360E, the main portion 360H may include the portion extending tobe parallel to at least one among the upper side edge E1, the right sideedge E3, and the left side edge E4 of the encapsulation substrate 210.In the peripheral portion 360E, the main portion 360H may include aportion contacting the top surface of the voltage transmission line 177.The main portion 360H of the peripheral portion 360E may be positionedat the side opposing the sealant 310 described below.

The spacer 360F of the peripheral portion 360E is connected to the mainportion 360H and may have a height that is higher than the height of themain portion 360H. In the peripheral portion 360E, at least a portion ofthe top surface of the spacer 360F may directly contact the bottomsurface of the encapsulation substrate 210. The thickness of the spacer360F of the peripheral portion 360E may be thicker than the thickness ofthe main portion 360H. In the peripheral portion 360E, the spacer 360Fis positioned on the edge side surface 186 of the second passivationlayer 180 b and may include the portion overlapping the edge sidesurface 186, however it is not limited thereto.

Referring to FIG. 4, the edge that does not contact the main portion360H among the edge of the spacer 360F of the peripheral portion 360Emay have a protrusion and depression shape, a sawtooth shape, or azigzag shape, among others. The edge having the protrusion anddepression shape of the spacer 360F may include a recess portion(depression) 36D and a convex portion (protrusion) 36P that arealternately arranged. The shape of the recess portion 36D and the convexportion 36P of the edge of the protrusions and depressions shape of thespacer 360F may be a ring shape such as a circular shape or an ovalshape, however it is not limited thereto, and it may be various shapessuch as triangular or quadrangular, for example. Also, in the peripheralportion 360E, the shape of the recess portion 36D and the convex portion36P of the edge of the protrusions and depressions shape of the spacer360F may be uniform along the extending direction of the spacer 360F, ordifferent shapes from each other may be regularly arranged.

The inclination portion 360N is connected to the spacer 360F of theperipheral portion 360E. The height of t most top surface of theinclination portion 360N is lower than the most top surface of thespacer 360F, and the thickness of the inclination portion 360N may besmaller than the thickness of the spacer 360F. Also, in the peripheralportion 360E, the thickness of the main portion 360H positioned outsidewith reference to the spacer 360F may be thicker than the thickness ofthe inclination portion 360N positioned near the display area DA withreference to the spacer 360F. The main portion 360H of the peripheralportion 360E is positioned on the region where there is no secondpassivation layer 180 b with reference to the edge side surface 186 ofthe second passivation layer 180 b, and the inclination portion 360N ofthe peripheral portion 360E may be positioned on the region where thesecond passivation layer 180 b exists with reference to the edge sidesurface 186 of the second passivation layer 180 b. Accordingly, theheight of the bottom surface of the main portion 360H of the peripheralportion 360E may be lower than the height of the bottom surface of theinclination portion 360N.

An inclination surface 36S as the top surface of the inclination portion360N may be an inclination surface toward the display area DA.

One height with reference to the lower substrate 110 of the inclinationsurface 36S of the inclination portion 360N may be lower farther awayfrom the portion connected to the spacer 360F. Referring to FIG. 4, theinclination surface 36S of the inclination portion 360N may be lower tobe close to the direction farther from the recess portion 36D and theconvex portion 36P of the adjacent spacer 360F.

Particularly, the inclination surface 36S of the inclination portion360N may form a concave inclination surface. As shown in FIG. 5, in aview of the cross-sectional view of the display device, a slope of animaginary tangent contacting the inclination surface 36S of theinclination portion 360N may have a decreased absolute value fartheraway from the portion connected to the spacer 360F. The inclinationsurface 36S of the inclination portion 360N may form a concave surface.The inclination surface 36S of the inclination portion 360N may have asimilar shape to the concave inclination surface of a sand dune.

As shown in FIGS. 4 to 6, the inclination portion 360N may be dividedinto a plurality of portions by the convex portion 36P of the spacer360F in a plan view. FIG. 5 depicts a sectional view where theinclination portion 360N is located, and FIG. 6 depicts a sectional viewwhere the inclination portion 360N is not located. Each portion of theinclination portion 360N may be positioned in the recess portion 36Dcorresponding to the spacer 360F in a plan view. Each inclinationsurface 36S of the inclination portion 360N may have the concaveinclination surface. The height of the inclination surface 36S of eachportion of the inclination portion 360N may be decreased substantiallytoward the center CT of the outside edge 36N that is not adjacent to thespacer 360F.

FIG. 6 shows a sectional view where the inclination portion 360N is notlocated. Referring to FIG. 6, the right-side lateral surface of thespacer 360F corresponding to a portion between neighboring inclinationportions 360N may have a different shape from the inclination surface36S of the inclination portion 360N but may have a similar shape as theleft-side lateral surface of the spacer 360F or have a similar or samedegree of inclination as the left-side lateral surface of the spacer360F. The embodiment, however, is not limited thereto, and theright-side lateral surface of the spacer 360F corresponding to a portionbetween neighboring inclination portions 360N may have a different shapefrom the left-side lateral surface of the spacer 360F. According tothis, the degree of inclination of the right-side lateral surface of thespacer 360F may vary more gradually than the left-side lateral surfaceof the spacer 360F, and the right-side lateral surface of the spacer360F have a rather similar shape as the inclination surface 36S of theinclination portion 360N. That is, the inclination portion 360Naccording to an embodiment may be continuously formed along theright-side of the spacer 360F rather than formed in a plurality ofseparated portions. In this case, the shape of the inclination surfaceor the inclination degree of the continuous inclination portion 360N mayvary periodically along the right-side of the spacer 360F.

The shape of the edge side in which each portion of the inclinationportion 360N divided by the convex portion 36P is adjacent to the spacer360F may depend on the shape of the recess portion 36D of the spacer360F. When the shape of the recess portion 36D is the curved line, theshape of the edge side in which each portion of the inclination portion360N is adjacent to the spacer 360F may be formed of the curved line. Inthis case, each portion of the inclination portion 360N may be formed ofthe shape such as a parabolic dune as an example.

FIG. 7 is a photo showing the plane shape of the display devicecorresponding to FIG. 4. Referring to FIG. 7, for the inclinationportion 360N, as described above, the height of the inclination surface36S above the lower substrate 110 is decreased toward the outer edge 36Nof the inclination portion 360N, as shown by an arrow AR. Also, FIG. 7shows an example in which the shape of the edge side where each portionof the inclination portion 360N is adjacent to the spacer 360F forms thecurved line such as the circle.

Referring back to FIG. 4, the outside edge 36N of the inclinationportion 360N that is not connected to the spacer 360F of the peripheralportion 360E may be approximately aligned to the outer sides of theconvex portion 36P of the spacer 360F, however it is not limited theretoand it may be shifted.

As shown in FIG. 4 and FIG. 7, the inclination portion 360N may overlapthe portion of the plurality of holes 97 of the voltage transmissionelectrode 197. In detail, the inclination portion 360N may be positionedcorresponding to the holes 97 of one column disposed nearest to thevoltage transmission line 177 among the plurality of holes 97 of thevoltage transmission electrode 197. When the inclination portion 360N isdivided into the plurality of portions by the convex portion 36P of thespacer 360F, each portion of the inclination portion 360N may bedisposed corresponding to one hole 97 or two or more holes 97 of thevoltage transmission electrode 197 as described above.

The pixel definition layer 360 may include a photosensitive materialsuch as a polyacrylate resin or a polyimide series.

In the display area DA, an emission member 370 is positioned on thepixel definition layer 360 and the pixel electrode 191. Referring toFIG. 2, the emission member 370 may include a first organic common layer371, a plurality of emission layers 373, and a second organic commonlayer 375 which are laminated in sequence.

The first organic common layer 371 may include at least one of a holeinjecting layer (HIL) and a hole transport layer (HTL). The firstorganic common layer 371 may be formed all over the display area inwhich the pixels PX are disposed, or may only be formed in each pixel PXregion.

The emission layer 373 may be positioned on the pixel electrode 191 ofeach corresponding pixel PX. The emission layer 373 may include anorganic material which uniquely emits light of the primary colors suchas red, green, and blue, and may have a structure in which a pluralityof organic material layers emitting light of different colors arelaminated. According to an embodiment, the emission layer 373 mayinclude a white emission layer representing a white color.

The second organic common layer 375 may include, for example, at leastone of an electron transport layer (ETL) and an electron injecting layer(EIL).

At least one of the first and second organic common layers 371 and 375may be omitted in some embodiments.

The opposing electrode 270 transmitting the common voltage ELVSS ispositioned on the emission member 370. The opposing electrode 270 ismainly positioned in the display area DA extends to the peripheral areasPA1 and PA2, as shown in FIG. 5 and FIG. 6, and is physically andelectrically connected to the voltage transmission electrode 197 throughthe contact hole 366 of the main portion 360H of the pixel definitionlayer 360, thereby receiving the common voltage ELVSS.

The opposing electrode 270 may include a transparent conductivematerial. For example, when the opposing electrode 270 includes a metalsuch as for example, Ca, Ba, Mg, Al, and Ag, the metal layer may bethinly formed to have a light transmissive function.

The pixel electrode 191, the emission member 370, and the opposingelectrode 270 of each pixel PX form a light emitting diode, and one ofthe pixel electrode 191 and the opposing electrode 270 serves as acathode, while the other serves as an anode.

The encapsulation substrate 210 facing the lower substrate 110 ispositioned on the opposing electrode 270.

The encapsulation substrate 210 may prevent moisture and/or oxygen frompassing through from the outside by encapsulating the emission member370 and the opposing electrode 270.

A sealant 310 is positioned between the lower substrate 110 and theencapsulation substrate 210. The sealant 310 is positioned in theperipheral area PA1 of the lower substrate 110 and the peripheral areaPA2 of the encapsulation substrate 210, and encloses the display area DAwhile forming the closed line. The sealant 310 combines and fixes thelower substrate 110 and the encapsulation substrate 210 and preventsimpurities such as moisture and oxygen from the outside from penetratingbetween the lower substrate 110 and the encapsulation substrate 210,thereby encapsulating the electric optical active layer of thelight-emitting device.

The sealant 310 may include a frit having excellent moisture resistance,and may also include an organic sealant and moisture absorbent.Particularly, the sealant 310 may include a sealant which is positionedbetween the lower substrate 110 and the encapsulation substrate 210 tofuse the lower substrate 110 and the encapsulation substrate 210 byapplying heat. In this case, the heat may be applied by using aninfrared lamp, a laser, or the like. Alternatively, the sealant 310 mayalso include a light absorbent which may absorb a laser, infrared light,or the like. The frit may generally use an oxide powder included in aglass powder, and may include an organic material so as to be in a pastestate. When the frit coated between the lower substrate 110 and theencapsulation substrate 210 is melted by applying heat, the lowersubstrate 110 and the encapsulation substrate 210 may be bonded to eachother through the fired frit, and internal elements of the displaydevice may be completely encapsulated.

The sealant 310 overlaps the thermal transmission layer 23 on the lowersubstrate 110 such that the heat may be easily transmitted through thethermal transmission layer 23 in the manufacturing process.

In one embodiment, if the inclination portion 360N included in theperipheral portion 360E of the pixel definition layer 360 forms theconcave inclination surface, when applying an impact to the displaydevice 1, the impact wave is dispersed or offset by the inclinationportion 360N such that the amount of the impact wave that is transmittedto the sealant 310 may be reduced. This is described with reference toFIG. 8 below.

Section (A) of FIG. 8 shows the shape in which the impact wave istransmitted to the edge side of the display device 1 when the impact isapplied to the display device 1, and sections (B) and (C) are the shapesin which the impact wave is dispersed or offset in the inclinationportion 360N in the right and left peripheral areas of the displaydevice 1 such that the impact wave is not transmitted to the edge regionwhere the sealant 310 is positioned. Particularly, the inclinationsurface 36S of the inclination portion 360N forms the concaveinclination surface such that the impact wave may be further effectivelydispersed.

According to one embodiment, the impact wave may be effectivelyprevented from being transmitted to the sealant 310 such that rigidityof the display device 1 may be improved, and a falling weight strengthimprovement result of more than about 10% may be obtained.

Furthermore, the strength of the display device 1 is improved such thatthe width of the sealant 310 may be reduced, thereby reducing the areaof the peripheral areas PA1 and PA2 or the bezel.

As shown in FIG. 5 and FIG. 6, the sealant 310 may not overlap thevoltage transmission electrode 197, however it is not limited thereto,and it may overlap a portion of the voltage transmission electrode 197.According to an embodiment, the peripheral portion 360E covering theedge of the voltage transmission electrode 197 includes the thick spacer360F such that the pressure by the sealant 310 is not transmitted to thevoltage transmission electrode 197 although the sealant 310 overlaps theperipheral portion 360E, thereby the voltage transmission electrode 197may be prevented from being easily broken. Accordingly, the displayfailure of the display area DA by a short between the voltagetransmission electrode 197 and the other electrodes may be prevented.

Furthermore, according to an embodiment, since the sealant 310 overlapsthe voltage transmission electrode 197, the width of the sealant 310 maybe reduced. Accordingly, the adherence of the lower substrate 110 andthe encapsulation substrate 210 may be improved such that the adhesionreliability is increased and the strength of the display device 1 may beincreased. Also, a process margin when forming the sealant 310 may bereduced such that the sealant 310 may be formed to be close to thedisplay area DA compared with the conventional art, thereby reducing thearea of the peripheral areas PA1 and PA2 of the display device 1 or thebezel.

Also, according to an embodiment, in the peripheral portion 360E of thepixel definition layer 360, the main portion 360H and the inclinationportion 360N having the lower height than the spacer 360F are positionedat both sides of the spacer 360F such that the change is smoothed whenthe distance between the lower substrate 110 and the encapsulationsubstrate 210 that are combined is partially changed, thereby entirelymaintaining the uniform distance between the lower substrate 110 and theencapsulation substrate 210. The peripheral portion 360E may function asthe buffer uniformly maintaining the distance between the lowersubstrate 110 and the encapsulation substrate 210, and the distancebetween the lower substrate 110 and the encapsulation substrate 210 nearthe sealant 310 and the distance between the lower substrate 110 and theencapsulation substrate 210 near the display area DA may be balanced.Accordingly, when the interval between the lower substrate 110 and theencapsulation substrate 210 is not uniform, the optical interferencephenomenon generated by the light incident from the outside may cause aNewton's ring. Therefore, the Newton's ring may be prevented by theinvention.

Next, a display device according to another embodiment will be describedwith reference to FIG. 9 to FIG. 11 as well as the previously describeddrawings. The same constituent elements as the embodiments describedabove are designated by the same reference numerals, and the duplicateddescription is omitted.

FIG. 9 is a layout view of a peripheral area of a display deviceaccording to an embodiment, FIG. 10 is an enlarged layout view of aregion A, a region B, or a region C as a part of a peripheral area ofthe display device shown in FIG. 9, and FIG. 11 is a cross-sectionalview of a display device of FIG. 10 taken along a line XI-XI.

Referring to FIG. 9 to FIG. 11, the display device 1 is the same as mostof the above-described embodiment, however an example in which thesealant 310 overlaps the peripheral portion 360E of the pixel definitionlayer 360 is shown. FIG. 10 and FIG. 11 show the example in which thesealant 310 overlaps the main portion 360H among the peripheral portion360E of the pixel definition layer 360, however it is not limitedthereto, and the sealant 310 may overlap the main portion 360H and thespacer 360F of the peripheral portion 360E of the pixel definition layer360.

Next, various examples of the structure of the peripheral area of thedisplay device 1 will be described with reference to FIG. 12 to FIG. 14as well as the previously described drawings. The same constituentelements as the embodiments described above designate the same referencenumerals, and the duplicated description is omitted.

FIG. 12, FIG. 13, and FIG. 14 are an enlarged layout view of a region A,a region B, or a region C as a part of a peripheral area of the displaydevice shown in FIG. 3, respectively.

Referring to FIG. 12, the display device 1 is the same as most of theembodiment shown in FIG. 1 to FIG. 8, however the inclination portion360N of the peripheral portion 360E of the pixel definition layer 360does not overlap the holes 97 of the voltage transmission electrode 197.In this case, the inclination portion 360N forms the concave inclinationsurface and the height of the inclination surface 36S thereof isdecreased, and the impact wave may be dispersed or offset.

However, when the inclination portion 360N overlaps the portion of theplurality of holes 97 of the voltage transmission electrode 197, theconcave inclination surface of the inclination portion 360N may befurther concave compared with the case that the inclination portion 360Ndoes not overlap the holes 97, as shown in FIG. 12.

Referring to FIG. 13, the display device 1 is the same as most of theembodiment shown in FIG. 1 to FIG. 8, however the shape of the spacer360F of the peripheral portion 360E of the pixel definition layer 360and the inclination portion 360N may be different.

The edge that is not connected to the main portion 360H among the edgesof the spacer 360F of the peripheral portion 360E may be a substantiallystraight line. Among the edges of the spacer 360F, the edge connected tothe main portion 360H and the edge that is not connected to the mainportion 360H may extend to be substantially parallel. Accordingly theinclination portion 360N extending to be parallel to at least one amongthe upper side edge E1, the right side edge E3, and the left side edgeE4 of the encapsulation substrate 210 may be entirely connected.

The edge connected to the spacer 360F of the inclination portion 360Nand the edge that is not connected to the spacer 360F may extend to besubstantially parallel. The inclination portion 360N may have thestraight line shape extending to be parallel to at least one among theupper side edge E1, the right side edge E3, and the left side edge E4 ofthe encapsulation substrate 210.

The inclination surface 36S of the inclination portion 360N is loweredfar from the portion connected to the spacer 360F. In one embodiment,the inclination surface 36S of the inclination portion 360N may belowered toward the display area DA. The slope of the tangent line forthe inclination surface 36S of the inclination portion 360N has thedecreased absolute value farther away from the portion connected to thespacer 360F, that is, to the display area DA, such that the inclinationsurface 36S of the inclination portion 360N may form the concave curvedsurface. As an example, the edge of the inclination portion 360N mayhave the shape such as the straight dune.

The inclination portion 360N may overlap the portion of the plurality ofholes 97 of the voltage transmission electrode 197, and in detail, theholes 97 of one column disposed closest to the voltage transmission line177.

Referring to FIG. 14, the display device 1 is the same as most of theembodiment shown in FIG. 13, however the inclination portion 360N of theperipheral portion 360E of the pixel definition layer 360 does notoverlap the holes 97 of the voltage transmission electrode 197. In thiscase, the inclination portion 360N also forms the concave inclinationsurface and the concave inclination surface 36S thereof may disperse andoffset the impact wave.

Next, various examples of the plane shape of the peripheral portion 360Eof the pixel definition layer positioned in the peripheral area of thedisplay device 1 will be described with reference to FIG. 15 to FIG. 21.

FIG. 15, FIG. 16, FIG. 17, FIG. 18, FIG. 19, and FIG. 20 are top planviews showing a plane shape of a peripheral portion of a pixeldefinition layer positioned in a peripheral area of a display deviceaccording to embodiments, and FIG. 21 is a photo showing an arrangementof a part of a peripheral area of a display device according to anembodiment.

First, referring to FIG. 15, the peripheral portion of the pixeldefinition layer 360 is the same as most of the peripheral portion 360Eof the embodiment shown in FIG. 1 to FIG. 8. FIG. 15 is an example inwhich the recess portion 36D of the spacer 360F, the edge side of theconvex portion 36P, and the edge of the inclination portion 360N are thequadrangle or the straight line.

Referring to FIG. 16, the peripheral portion of the pixel definitionlayer 360 is the same as most of the peripheral portion 360E of theembodiment shown in FIG. 1 to FIG. 8, however the recess portion 36D ofthe spacer 360F and the edge side of the convex portion 36P form atleast a partial curved line shape. Accordingly, the edge of theinclination portion 360N adjacent to the spacer 360F may also be formedof the curved line shape. Each outer edge 36N of the plurality ofportions of the inclination portion 360N divided by the convex portion36P of the spacer 360F may be formed of the straight line shape.Referring to FIG. 16, the outside edge of the convex portion 36P of thespacer 360F may be positioned outside the extending line of the outeredge 36N of the plurality of the portions of the inclination portion360N, however it is not limited thereto.

Referring to FIG. 17, the peripheral portion of the pixel definitionlayer 360 is the same as most of the peripheral portion 360E of theembodiment shown in FIG. 1 to FIG. 8, however a boundary line of thespacer 360F and the inclination portion 360N have a sawtooth shape or azigzag shape. Accordingly, the edge of the inclination portion 360Nadjacent to the spacer 360F may be also formed of the sawtooth shape orthe zigzag shape. Each outer edge 36N of the plurality of portions ofthe inclination portion 360N divided by the convex portion 36P of thespacer 360F may be formed of the substantially straight line shape.Referring to FIG. 17, an apex of the convex portion 36P of the spacer360F may be aligned to the extending line of the outer edge 36N of theplurality of portions of the inclination portion 360N, however it is notlimited thereto.

Referring to FIG. 18, the peripheral portion of the pixel definitionlayer 360 is the same as most of the peripheral portion 360E of theembodiment shown in FIG. 1 to FIG. 8, however the planar length of theconvex portion 36P of the spacer 360F is not uniform. For example, inthe edge having the protrusions and depressions of the spacer 360F, theconvex portion 36P of the long length and the convex portion 36P of theshort length may be alternately disposed according to the extendingdirection of the spacer 360F.

Referring to FIG. 19, the peripheral portion of the pixel definitionlayer 360 is the same as most of the peripheral portion 360E of theembodiment shown in FIG. 1 to FIG. 8 or the embodiment shown in FIG. 15.FIG. 19 shows an example in which each portion of the inclinationportion 360N is disposed corresponding to the holes 97 of the voltagetransmission electrode 197 to overlap the holes 97 when the inclinationportion 360N is divided into the plurality of portions by the convexportion 36P of the spacer 360F. Furthermore, the holes 97 adjacent tothe holes 97 overlapping the inclination portion 360N are aligned withthe holes 97 overlapping the inclination portion 360N, thereby formingthe approximate matrix shape.

Referring to FIG. 20, the peripheral portion of the pixel definitionlayer 360 is the same as most of the embodiment shown in FIG. 19,however the holes 97 adjacent to the holes 97 overlapping theinclination portion 360N are not aligned, but are shifted from the holes97 overlapping the inclination portion 360N. That is, the holes 97adjacent to the holes 97 overlapping the inclination portion 360N may bedisposed on the line parallel to the space between the holes 97overlapping the inclination portion 360N. FIG. 21 shows the plane shapeof the display device corresponding to FIG. 20.

Next, a manufacturing method of the display device according to anembodiment will be described with reference to FIG. 22 to FIG. 24 aswell as the above-described drawings.

FIG. 22 is a cross-sectional view of a coating layer and a photomask fora pixel definition layer in one process of a manufacturing method of adisplay device according to an embodiment, FIG. 23 is a cross-sectionalview of a pixel definition layer in the process shown in FIG. 22 in aprocess of a manufacturing method of a display device according to anembodiment, and FIG. 24 is a cross-sectional view of a pixel definitionlayer in the process shown in FIG. 23 in a process of a manufacturingmethod of a display device according to an embodiment.

First, referring to FIG. 22 along with FIG. 5 and FIG. 6, the bufferlayer 111, the semiconductor layer, the gate insulating layer 140, theplurality of gate conductors, the first passivation layer 180 a, theplurality of data conductors, and the second passivation layer 180 b areformed on the lower substrate 110 including the transparent glass orplastic, and the pixel electrode layer including the pixel electrode 191and the voltage transmission electrode 197 is formed thereon.

The pixel electrode layer includes the top surface having a high portionand a low portion formed by an following step, for example, a step dueto the edge side surface 186 of the above-described second passivationlayer 180 b.

Next, the photosensitive material such as the polyacrylates resin or thepolyimide resin is coated on the pixel electrode layer to form a coatinglayer 3600.

Subsequently, a photomask 50 is disposed on the coating layer 3600 andexposure is performed. The photomask 50 includes a transmissive part Twhere most of the light is transmitted, a semi-transmissive part H wherethe light is partially transmitted, and a light blocking portion O wheremost of the light is not transmitted. To control the transmissionamount, the semi-transmissive part H may include a pattern such as aslit or a lattice or may include a semi-transparent layer.

Next, referring to FIG. 23, the coating layer 3600 exposed through thephotomask 50 is developed to form a main portion 360H and a spacer 360F.When the coating layer 3600 has negative photosensitivity of which theportion that is not irradiated by the light is removed, the main portion360H corresponding to the semi-transmissive part H of the photomask 50and the spacer 360F corresponding to the transmissive part T of thephotomask 50 are formed, and the coating layer 3600 corresponding to thelight blocking portion O of the photomask 50 may be removed. Thethickness of the spacer 360F is greater than the thickness of the mainportion 360H. Particularly, in the peripheral area of the displaydevice, the main portion 360H is respectively positioned at both sidesof the spacer 360F covering the edge of the voltage transmissionelectrode 197, and two main portions 360H are connected to the spacer360F. Depending on the step of the pixel electrode layer, the bottomsurface of the main portion 360H connected to the left side of thespacer 360F may be lower than the bottom surface of the main portion360H connected to the right side of the spacer 360F. Here, the rightside of the spacer 360F may be the side that is closer to the displayarea DA. The thickness of the main portion 360H connected to the leftside of the spacer 360F may be greater than the thickness of the mainportion 360H connected to the right side of the spacer 360F.

When the photosensitive material included in the coating layer 3600 haspositive photosensitivity, as opposed to negative photosensitivity, thetransmittance of the photomask 50 is conversely changed and the coatinglayer 3600 is exposed, thereby forming the main portion 360H and thespacer 360F.

Next, referring to FIG. 24, a hardening process of applying heat orultraviolet rays to the main portion 360H and the spacer 360F isperformed to form the pixel definition layer 360. In this case, in theperipheral area of the display device, the top surface of the mainportion 360H connected to the left side of the spacer 360F covering theedge of the voltage transmission electrode 197 may be formed of theconvex curved surface, and the top surface of the main portion 360Hconnected to the right side of the spacer 360F may be formed of theconcave inclination surface 36S, thereby forming the inclination portion360N. This is one of the reasons that the thickness of the main portion360H connected to the left side of the spacer 360F is relatively thickand the thickness of the main portion 360H connected to the right sideof the spacer 360F is relatively thin.

When the main portion 360H connected to the right side of the spacer360F overlaps the holes 97 of the voltage transmission electrode 197,the concave inclination surface 36S of the inclination portion 360N maybe further well formed.

According to another embodiment, in the peripheral portion 360E of thepixel definition layer 360, the main portion 360H positioned between thespacer 360F and the sealant 310 may be omitted and may have the topsurface having substantially the same height as the top surface of thespacer 360F.

While this invention has been described in connection with certainembodiments, it is to be understood that the invention is not limited tothe disclosed embodiments, but, on the contrary, is intended to covervarious modifications and equivalent arrangements included within thespirit and scope of the appended claims.

What is claimed is:
 1. A display device comprising: a first substrateincluding: a display area including a plurality of pixels, and aperipheral area around the display area; a thin film transistor on thefirst substrate; a voltage transmission line in the peripheral area andtransmitting a common voltage; a passivation layer on the thin filmtransistor and the voltage transmission line; a pixel electrode on thepassivation layer and in the display area; a voltage transmissionelectrode on the passivation layer and in the peripheral area, thevoltage transmission electrode having a hole; and a layer including aperipheral portion on the voltage transmission electrode, wherein theperipheral portion has an edge curved around an edge of the hole of thevoltage transmission electrode in a plan view.
 2. The display device ofclaim 1, wherein the peripheral portion comprises: a spacer; and aninclination portion connected to the spacer and positioned at a firstside of the spacer, wherein the inclination portion has a concaveinclination surface.
 3. The display device of claim 2, wherein theinclination portion overlaps the hole.
 4. The display device of claim 2,an edge of the spacer at the first side has a shape of protrusions anddepressions that are alternately arranged in the plan view.
 5. Thedisplay device of claim 4, wherein the inclination portion includes aportion positioned in the depression in the plan view.
 6. The displaydevice of claim 2, further comprising a second substrate opposing thefirst substrate, wherein the spacer maintains a gap between the firstsubstrate and the second substrate.
 7. The display device of claim 2,wherein the spacer and the inclination portion are elongated along anedge side of the first substrate.
 8. The display device of claim 1,wherein the peripheral portion has an edge having a shape of protrusionsand depressions that are alternately arranged in the plan view.
 9. Thedisplay device of claim 1, wherein the passivation layer includes anedge side surface exposing the voltage transmission line.
 10. Thedisplay device of claim 9, wherein the peripheral portion overlaps theedge side surface of the passivation layer.
 11. The display device ofclaim 9, wherein the voltage transmission electrode overlaps the edgeside surface of the passivation layer.
 12. The display device of claim1, wherein the layer comprises a photosensitive material including aresin.